Capabilities Summary

 

Rigid Board

Materials:

Polyimide & Epoxy, BT, PTFE, Thermoset Microwave, Speedboard™ C

Capabilities:

Multilayers to 30 Layers+

Heatsinks & Metal Cores

Blind & Buried Vias

Laser Vias, Stacked Vias, Copper and Epoxy Filled Vias

Quality Systems

AS 9100:2004

ISO 9001:2000

 

         Complex Printed Circuit Boards

Flexible & Rigid-Flex Boards

Bookbinders, Blind &

Buried Vias

Acrylic & Adhesiveless

Laser Vias, Stacked Vias, Copper

Filled Vias, & non conductive fills

Multilayer to 26 Layers

Metal Cores

Impedance Controlled

Contact: info@ventmark.com           Or Call: 805-795-3968        Ventmark Technology Solutions

 

 

 

 

 

Leading manufacturers of technically demanding printed circuit boards, flex circuits, rigid-flex circuits, multichip modules (MCM-L), metal core boards and RF/microwave boards. From fast turn prototype to medium volume production quantities, and designs including multilayer circuit boards to 26 layers or more; flexible and rigid-flex circuits. Lead times are flexible to meet customer requirements, from as little as 24 hours up to multiple release contracts covering a year or more. Available features include: .003" lines and spaces, and 0.006" drilled holes, and specialized materials such as polyimide, high Tg FR-4, BT, Cyanate Ester, PTFE, Aramid, and metal heat sinks and backings.