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Capabilities Summary
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Rigid Board Materials: Polyimide & Epoxy, BT, PTFE, Thermoset Microwave, Speedboard™ C Capabilities: Multilayers to 30 Layers+ Heatsinks & Metal Cores Blind & Buried Vias Laser Vias, Stacked Vias, Copper and Epoxy Filled Vias Quality Systems AS 9100:2004 ISO 9001:2000 |

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Complex Printed Circuit Boards |
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Flexible & Rigid-Flex Boards Bookbinders, Blind & Buried Vias Acrylic & Adhesiveless Laser Vias, Stacked Vias, Copper Filled Vias, & non conductive fills Multilayer to 26 Layers Metal Cores Impedance Controlled |
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Leading manufacturers of technically demanding printed circuit boards, flex circuits, rigid-flex circuits, multichip modules (MCM-L), metal core boards and RF/microwave boards. From fast turn prototype to medium volume production quantities, and designs including multilayer circuit boards to 26 layers or more; flexible and rigid-flex circuits. Lead times are flexible to meet customer requirements, from as little as 24 hours up to multiple release contracts covering a year or more. Available features include: .003" lines and spaces, and 0.006" drilled holes, and specialized materials such as polyimide, high Tg FR-4, BT, Cyanate Ester, PTFE, Aramid, and metal heat sinks and backings. |