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Ultra Miniaturization |
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Using standard off the shelf processes and a mature production capability, Ultra Miniaturization enables developers to create unique solutions for their microelectronic packaging needs.
System in Package solutions provide the ability to create innovative designs in miniature form factors for a fraction of custom IC design costs.
This capability takes advantage of existing technologies applied in combination to create new option for designs driven by size and weight, such as wireless devices, implantable medical devices and sensors for micro miniature unmanned vehicles. |
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Contact: info@ventmark.com Or Call: 805-795-3968 Ventmark Technology Solutions |
