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As a mature, well documented technology, ceramic High Density Interconnect (HDI) substrates are used across a wide variety of applications, including medical devices (external and implanted), commercial and military sensors and other markets where size, weight and reliability are paramount. With excellent high frequency properties, HDI offers exceptionally good cost/wiring density ratios. Offering 2 sided, multi-layer capabilities, with line and space widths down to .001”. Available features include laser defined vias and cavity etching for MEMS applications |
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Thick Film Ceramic Substrate |
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Substrate Materials |
AlN and Al2O3 |
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Substrate Thickness |
As required (typically range: 200um – 1000um) |
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Through Hole Size |
125um (min.) – laser machined |
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Through Hole Connection |
solid filled plug (typically Ag based) |
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Thick Film Metallizations Available |
Au, Ag, Ag-Pd, Ag-Pt, Cu, others |
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Conductor Layer Resolutions |
Printed 100um lines/spaces |
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FodelTM (Ag-based) 50um lines/spaces |
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Etched Au 25um lines/spaces |
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Dielectric Material Properties |
Breakdown Voltage: > 1.84 kV (@ 25um thickness) |
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Dielectric Constant: 8 – 10 (@ 1 MHz) |
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Dissipation Factor: < 0.2% (@ 1 MHz) |
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Dielectric Layer Via Openings |
50um diameter (min.) |
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Integrated Thick Film Resistors |
Range: 2.5ohm – 20Mohm (laser trimmed: passive & active) |
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Tolerance: 0.5% (absolute), 0.1% (ratio) |
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Temperature Coefficient: 50ppm/oC |
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Power Dissipation: 100W/in2 |