|
3D Microelectronics |
|
Working with leading providers of miniature electronics packaging technology , Ventmark will match your requirements with the optimum solution. We provide ultra-miniature 3D chip-stacking and packaging capability in a variety of device form factors and materials, from low cost encapsulated QFN style packages, to fully compliant hermetic packages for harsh environments. Providing a full suite of supporting technologies, including wafer thinning, bumping and dicing, Ventmark can take standard components and shrink circuits to a fraction of their original size. |
|
Contact: info@ventmark.com Or Call: 805-795-3968 Ventmark Technology Solutions |
